multilayer board
multilayer board是什么意思、multilayer board怎么读
读音：[ˌmʌltɪˈleɪə bɔːd]
[ˌmʌltiˈleɪər bɔːrd]
multilayer board 基本解释
多层印刷板
重点词汇
- boardn. 木板, 甲板, 膳食, 会议桌 vt. 乘船, 供膳食, 用板覆盖 vi. 搭伙 [计] 板
- multilayer[计] 多层(印刷电路板) [化] 多层
multilayer board 双语例句
- 1、
Numerical Simulation of Warhead Penetrating into Multi-Layer Spaced Target ALIVH multilayer printed Board
用数值模拟法研究战斗部侵彻多层间隔靶层间全内导通多层印制板 - 2、
Improvement of Multilayer Printed Board Quality by Relieving Residual Hot-pressing Stress
层压板热压释放残余应力对多层印制板品质的改善 - 3、
Suitable for medium multilayer printed circuit board, computer, communication equipment, OA equipment, lead-free PCB process etc.
适合于多层PCB、计算机及外围设备、通讯设备、办公自动设备、PCB无铅制程等。 - 4、
Control Effect of Occupational Hazards in Production Project of Multilayer Printed Circuit Board
某多层线路板生产项目职业病危害控制效果评价 - 5、
Making Multilayer printed board has a complex working procedure and long period, then the reason of causing Void PTH is very complex.
多层印制板的制作是一个生产工序复杂且周期很长的过程，那么造成金属化孔镀层空洞的原因也就很复杂。 - 6、
Study on the Processing Technology of the Step Designed Planar Buried Resistant Microwave Multilayer Printed Circuit Board
埋电阻台阶式多层微波印制板制造技术研究微波印制电路板制造工艺及其电阻集成 - 7、
The fabrication procedure of two kinds of microwave multilayer printed circuit board filled with ceramic particles is briefly introduced.
简单介绍两种陶瓷粉填充微波多层印制板的制造工艺流程。 - 8、
ALIVH multilayer printed Board sequentially-laminated mulitlayer
层间全内导通多层印制板 - 9、
Study on the Technics of the Pressing of Microwave Multilayer Printed Circuit Board/ Ceramic Particle Filled Laminates
微波多层印制板层压工艺技术研究 - 10、
Current Condition of Build-up Multilayer Wiring Board in Application Market
积层多层板应用市场的现状 - 11、
High Density Multilayer Printed Circuit Board Produce Process Mesne Quality Manage Simple Discuss
高密度多层印制电路板生产过程中的品质管理浅议 - 12、
Preparation and application of liquid photo-imageable ink for build-up multilayer board
积层线路板用液态感光成像油墨的应用研究 - 13、
Black oxidation technology for copper in multilayer printed circuit board was introduced.
介绍了多层印制线路板内层铜墙表面的黑氧化技术。 - 14、
Single Laminate multilayer board Material and Relative Process Sol μ v
一次层压多层板材料和相应工艺Solμv - 15、
Tin Plating Protective Technology in Production of Multilayer Printed Circuit Board
多层印制板生产中的电镀锡保护技术 - 16、
Advanced packaging technology represented by CSP and the development of build up-type multilayer printed wiring board ( PWB) that make such high-density packaging possible are making greatly progress.
以CSP为代表的先进封装技术和可以实现高密度封装的确积层多层板的开发已经取得了很大的进步。 - 17、
Automatic Routing for the Wiring of Multilayer Printed Circuit Board DBX 2
多层印制底板自动布线系统DBX2 - 18、
This article provide an method to control and improve warpage of multilayer printed board by control laminating technol-ogy.
本文从多层板层压工艺控制入手，提出了控制或改善多层板翘曲度的方法。 - 19、
Study on the Manufacturing Technology of the Buried/ Blind Via Multilayer Printed Circuit Board
埋/盲孔多层印制板制造技术研究 - 20、
The Technology of Laminating of Multilayer Printed Circuit Board and the Methods of Decreasing the Warp
多层印制板层压工艺及减少翘曲产生的方法 - 21、
Automatic routing system of multilayer print circuit board implemented on Microcomputer
在微机上实现的多层印制板自动布线系统 - 22、
Polyimide multilayer board Laminated in Gang Operation
聚酰亚胺一次层压型多层板 - 23、
This paper describes the development of single laminate multilayer board material and relative process Sol μ v, sample fabrication and application development.
概述了一次层压多层板材料和相应工艺Solμv的开发，试样制造和应用发展。 - 24、
DV multilayer board for Hign Density Mounting
高密度安装用的DV多层板 - 25、
Synthesis of UV Photosensitive Prepolymer for Build-up multilayer board
积层电路板用UV感光预聚物的合成 - 26、
Optimum of Technology Parameters about Lamination of Flexible Multilayer Printed Board with Orthogonal Experiment
用正交试验法优化挠性多层板层压工艺参数 - 27、
Research for Automatically Testing Inner Conductive Circuit of High-Accuracy multilayer board
高精度多层板内层导电线路自动测试研究 - 28、
Integrated Package Technique of Multilayer Wiring on Silicon Based Board
硅基多层布线集成组装技术 - 29、
It is improved multilayer aluminum foil target board structure, and can realize the target signal detection and target in the area of judgment;( 3) software system.
改进多层铝箔靶板结构，可以实现对中靶信号检测和中靶区域判断；（3）软件系统。 - 30、
At the same time, selecting the appropriate material with silver electrode to achieve sintered at low temperatures, thus making multi-component or to passive components buried in multilayer circuit board becoming an inevitable outcome of the above-mention
同时选择适当的能与银等导电材料在低温下实现共烧，从而制作多层元件或把无源器件埋入多层电路基板中，成为上述趋势的必然要求。