thermocompression bonding
thermocompression bonding是什么意思、thermocompression bonding怎么读
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thermocompression bonding 基本解释
网络 热压接合; 热压粘合
重点词汇
- bondingn. 结合, 屏蔽接地, 搭接 [计] 压焊
thermocompression bonding 双语例句
- 1、
Section 13. 3 covers the thermocompression bonding process itself and also tape automated bonding.
13.3节的内容既涉及热压连接工艺本身，也涉及了自动连接的传送带技术。 - 2、
The thermocompression wire bonding strength was tested with bonding tester. The strength was over 0.17 N.
使用接合强度测试仪对压焊键合点强度进行了拉断试验，测得键合强度拉断力都在0.17N之上。 - 3、
In this paper we reported the process and principle of large-area GaAs epitaxial plate thermocompression bonded to K4 window-glass technology, and emphatically discussed the effects of the deposition of SiN film, the controlling of bonding temperature and
本文报道制备GaAs透射式光阴极过程中窗玻璃与大面积GaAs外延片热压粘结工艺的原理和过程，并重点分析抗反射膜的淀积、粘结温度控制和压力大小对粘结结果的影响。 - 4、
The technological processes of thermocompression bonding and adhesion are introduced to combine the F46 film with the nickel plating leaded brass sheet.
介绍了用热合和粘接两种方法实现驻极体F46薄膜与镀镍铅黄铜金属片接合的工艺过程。 - 5、
In piezoresistive pressure sensor packaging process, the thermocompression wire bonding was studied to meet the outer interconnection of silicon gauge.
为满足压阻式压力传感器封装工艺中硅芯片外引线键合的要求，研制了热压焊简易装置； - 6、
A Novel Instrument of Thermocompression Wire Bonding
一种硅芯片外引线键合的热压焊简易装置