gold solder

gold solder 基本解释

网络  金焊; 金焊条; 金焊料

医学

重点词汇

• soldern. 焊接剂, 接合物 v. 施以焊接, 焊合, 联结
• goldn. 黄金, 钱财, 金块, 金色, 宝贵 a. 金的, 似金的, 金色的, 金制的

gold solder 双语例句

1. 1、 If the metal that was under the gold is not oxidized, the gold-contaminated solder will bond to it.
   如果镀金层覆盖的金属没有氧化，则带有金成分的焊料将会粘连在该金属上。
2. 2、 This paper servers as a summary review of the complex factors such as the prepare, the process of electroless nickel, immersion gold, the rinse after immersion gold, the solder.
   本文总结了影响化学镀镍金可焊性的复杂因素如：前处理的影响、化学镀镍过程的影响、浸金的影响、浸金后水洗的影响、焊料的影响。
3. 3、 Influence of Gold Addition on the Performance of Sn_ ( 63) Pb_ ( 37) Eutectic Solder
   金对Sn（63）Pb（37）共晶钎料性能的影响
4. 4、 Central processing unit ( CPU), a significant electronic component with a high gold content, was taken in experiment. CPU was pre-processed by centrifugal separation, solder smelting and vacuum pyrolysis to separate the pins from the base plates.
   以中央核处理器（CPU）这一典型的金含量高的电子废弃物为实验对象，采用油浴离心分离法、熔锡法及真空热解法对CPU进行预处理以实现针脚的分离。