surface mounting technology
surface mounting technology是什么意思、surface mounting technology怎么读
读音：[ˈsɜːfɪs ˈmaʊntɪŋ tekˈnɒlədʒi]
[ˈsɜːrfɪs ˈmaʊntɪŋ tekˈnɑːlədʒi]
surface mounting technology 基本解释
网络 表面贴装技术; 表面粘着技术; 表面组装技术; 表面安装技术; 装技术
重点词汇
- surfacen. 面, 表面, 水面, 外表, 平面 a. 表面的, 外观的, 肤浅的, 水面上的 vt. 使成平面, 使浮出水面 vi. 浮出水面, 呈现, 在地面上工作
- technologyn. 技术, 工业技术, 术语 [医] 技术学, 工艺学
- mountingn. 装备, 衬托纸, 舞台效果, 上马 [化] 装配
surface mounting technology 双语例句
- 1、
Application of surface mounting technology in Intelligent Circuit-Breakers
表面贴装技术在智能型断路器中的应用 - 2、
In the surface mounting technology, the result of the solder printing is very big to the product quantity.
在电子装联技术中，焊膏印刷的效果对产品质量关系极大。 - 3、
The existence conformations and functions of gold in such boards and blocks have been changed greatly with the development of flaky elements and surface mounting technology ( SMT).
片状元器件和表面安装技术的发展，使电脑板卡中金的存在形态和功能发生了较大变化。 - 4、
Surface Mounting and Chip Bonding Technology
表面组装与芯片键合混合工艺浅探 - 5、
surface mounting technology and Its Applications in Optoelectronic Devices
表面安装技术及其在光电子器件中的应用 - 6、
To Make Low-pass Filter Modules Using surface mounting technology
表面贴装低通滤波器模块的制作 - 7、
Information Automatic Gaining of Soldered Joint on surface mounting technology Printed Circuit Board
表面组装印刷电路板上焊点信息的自动获取 - 8、
Mounting of PCB by surface mounting technology
表面安装印制板 - 9、
Requirements for Printed Circult Board Design in surface mounting technology
表面贴装技术中对印刷电路板的设计要求 - 10、
Considered as a special IC, the pressure sensor integrates diffusion silicon sensing element, circuit for temperature compensation and signal conditioned circuit on a chip in the form of thick film hybrid IC, through using thick film technology and surfac
将集成压力传感器作为一种特殊的集成电路，采用厚膜工艺与表面组装技术，以厚膜混合集成电路的形式，实现了扩散硅力敏元件与温度补偿电路及信号放大电路的集成。 - 11、
The main performances of the gold-silicon surface barrier detectors with new mounting configuration manufactured by advance technology are described in this report.
文中介绍了用新工艺制成的新结构金硅面垒型探测器的主要性能。 - 12、
However, factors like circuit design, material selection, assembly process and service environment can cause failures during surface mounting technology ( SMT) or service.
然而，在表面贴装器件时或使用过程中，常会因电路设计、板件选材、组装工艺、服役环境等因素造成PCB失效。 - 13、
As the development of surface mounting technology towards to lightly, thin and micro-miniature, traditional inspection arithmetic can not satisfy productive demand so that Automatic Optical Inspection ( AOI) has gotten an extensive investigation.
随着微电子表面组装技术不断向轻型化、薄型化、微小化发展，传统的检测方法已经不能满足实际生产的需要，因此，自动光学检测技术得到广泛的研究。