flip-chip bonding

flip-chip bonding 基本解释

倒装式接合法；倒装焊接

计算机

重点词汇

• chipn. 屑片, 薄片, 碎片 vt. 削, 切, 削成碎片, 使摔倒, 凿 vi. 削下屑片 [计] 孔屑; 组件; 晶片; 芯片
• flipvt. 掷, 弹, 轻击, 空翻 vi. 用指轻弹, 抽打, 蹦跳 n. 抛, 弹, 筋斗 a. 无礼的 [计] 翻转
• bondingn. 结合, 屏蔽接地, 搭接 [计] 压焊

flip-chip bonding 双语例句

1. 1、 Influence of Temperature on Alignment Accuracy in the Thermosonic flip-chip bonding
   热超声倒装键合中温度对对准精度的影响
2. 2、 flip-chip bonding technology is a potential process in the electronic packaging.
   凸点芯片倒装焊接是一种具有发展潜力的芯片互连工艺技术。
3. 3、 flip-chip bonding Technology Application of Electroplating Technology to Solder Bumping Formation
   凸点芯片倒装焊接技术电镀技术在凸点制备工艺中的应用
4. 4、 Nonlinear Dynamical Behaviors in Flip-Chip Thermosonic Bonding
   热超声倒装键合过程中的非线性动力学行为
5. 5、 Research on flip-chip bonding Techniques for Hybrid Focal Plane Array Applications
   混成式焦平面阵列芯片倒装互连技术研究
6. 6、 The technologies of MEMS packaging are introduced, including three promising technologies: wafer level packaging, single-chip packaging and multi-chip packaging, modular MEMS packaging and flip-chip bonding for MEMS packaging.
   介绍了微机电（MEMS）封装技术，包括晶片级封装、单芯片封装和多芯片封装、模块式封装与倒装焊3种很有前景的封装技术。
7. 7、 It is shown that the large refractive index difference between GaN and Al_2O_3 seriously limits the improvement of light extraction efficiency. The extraction efficiency is enhanced at least 20% by using the structure of flip-chip bonding than that of the
   结果表明，GaN与蓝宝石之间的较大折射率差别严重限制了芯片光提取效率的提高，通过蓝宝石背面出光比通过p型GaN层的正面出光的芯片光提取效率至少高20%；
8. 8、 The stability and the delay time of the scan working model trigger system and the interrupt working model trigger system were compared and studied by the experiment of synchronization trigger of the thermosonic flip-chip bonding.
   通过热超声倒装键合测量系统同步触发实验对比研究了单片机扫描工作模式和单片机中断工作模式触发系统的稳定性和触发延迟方面的性能。
9. 9、 Solder Bump flip-chip bonding Technology
   凸点芯片倒装焊接技术
10. 10、 The preparation of metal bump and wire substrate have been researched, as well as flip-chip bonding technology.
    对金属凸点、引线衬底的制备以及倒装焊接技术进行了研究。