immersion plating

immersion plating 基本解释

网络  浸渍电镀; 浸渍镀; 浸镀; 浸镀法; 浸鍍法

计算机

重点词汇

• immersionn. 沉浸, 专心, 陷入 [医] 浸, 浸渍
• platingn. 电镀, 镀层, 金属外表的镀层, 装甲 [化] 喷镀

immersion plating 双语例句

1. 1、 In this paper, the characteristic, electrochemistry principle and technological controls of immersion plating depositions were reviewed, which are keen surface technology in electronic field.
   分析了基于硫酸盐光亮酸性镀铜体系的钢铁件浸镀铜工艺工业化应用的不可行性，以及浸镀与电沉积相结合的酸性镀铜工艺的特点。
2. 2、 Study on Zn-Ni immersion plating on Magnesium Alloy before Nickel Electroless Plating
   热浸镀锌板镀层相结构的穆斯堡尔谱研究镁合金化学镀镍前浸镀锌-镍合金的研究
3. 3、 Effect of Polyethylene Imine on Corrosion of Electroless Nickel Substrates during Immersion Gold Plating
   聚乙烯亚胺对置换镀金过程中镍基体腐蚀的影响
4. 4、 The optimal combination has been found for the Bi, Sb contents and the temperature of immersion plating.
   由试验还得到了Bi和Sb的含量及热浸镀温度的优化组合条件。
5. 5、 Gilding and Tarnish-preventing Processes Gold imitation deposition by immersion plating
   仿金镀与防变色工艺
6. 6、 A copper conversion film on carbon steel surface was obtained in copper immersion plating solution.
   采用浸渍法在碳钢表面获得了铜化学沉积膜。
7. 7、 Site-selective immersion plating of silver on Si-NPA which has different oxidation status on surface is observed.
   银离子在具有不同氧化状况的Si-NPA表面呈现位置选择性沉积。
8. 8、 Technique of quick immersion copper-plating on steel
   钢铁件快速化学浸镀铜工艺研究
9. 9、 The result shows that the advantages of galvanic current method over ordinary capacity titration are more direct, convenient, faster and can be tested on-line, being suitable for timely adjusting the technology of immersion silver plating for PCB.
   结果表明，与常规的容量滴定法相比，采用电偶电流法测定浸镀银的沉积速度，不仅直观、方便、速度快，而且能进行在线检测，有利于及时对印刷电路板的浸银工艺进行调整。
10. 10、 immersion plating of copper-tin alloy on steel and iron
    钢铁浸镀铜锡合金工艺研究
11. 11、 A new immersion plating process was developed in which copper sulfate and stannous sulfate were used as main salt, with addition of complex, brightener and stabilizer to tin salt.
    采用硫酸铜、硫酸亚锡为主盐，加入络合剂、光亮剂、锡盐稳定剂，研究成功了一种新的浸镀铜锡合金工艺。
12. 12、 Galvanic current method for measuring electrodeposition velocity of immersion silver plating for printed circuit board
    一种新的印刷电路板浸银镀速的测定方法
13. 13、 Elimination of Immersion Silver Plating Defects
    消除浸银工艺缺陷
14. 14、 Rapid Dertermination of Acrylic Thiourea and Fe ￣( 2+) Ion in Copper immersion plating Solution
    浸铜液中丙烯硫脲和Fe~（2＋）离子浓度的快速测定
15. 15、 Study on SERS-active Au substrate Prepared by immersion plating
    浸镀法制备SERS活性金衬底研究
16. 16、 The variance analyses show that the effect r of interaction between force bismuth and the temperature of immersion plating on growth of in~ ilies is mest remarkable.
    经方差分析，结果表明，微量元素铋与热浸镀温度间的交互作用对化合物生长影响最显著；
17. 17、 Implementing a Simple Corrosion Test Methodology for Early Detection of Black Pad Phenomenon in Electroless Nickel/ Immersion Gold Plating
    镍层耐硝酸腐蚀性测试&一种简单的预先探测ENIG镍层黑盘现象的测试方法
18. 18、 High Adhesive Semibright Immersion Copper-Plating Process
    高结合力半光亮化学浸铜工艺研究
19. 19、 Direct immersion plating Process of Golden Cu-Sn Alloy on Iron and Steel
    钢铁件直接浸镀Cu-Sn合金
20. 20、 The technology of the bright Sn-Pb alloy electroplating on aluminum and aluminum alloy with the pretreatment method of zinc-nickel immersion plating and nickel pre-electroplating was studied. An intermediate layer was formed by the pretreatment method.
    研究了采用浸锌-锡合金与预镀镍相结合的方法，在铝及其合金表面形成一层中间层再电镀光亮锡-铅合金工艺。
21. 21、 Moreover, millipore silicon arrays were also used as templates for silver nanostructures, and novel silicon-based silver nanostructures were obtained through immersion plating method, and the enhancement ability and uniformity of the novel SERS substrates
    而以微孔硅阵列作为模板，利用浸镀法得到了新颖的硅基银纳米结构，其拉曼增强活性和均匀性都比较好。